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Semiconductor packaging apparatus and method

2023-01-11 来源:华佗健康网
专利内容由知识产权出版社提供

专利名称:Semiconductor packaging apparatus and

method

发明人:Young, William Ronald,Ports, Kenneth A.申请号:EP97107670.8申请日:19970509公开号:EP0810659A3公开日:19990804

专利附图:

摘要:Semiconductor devices 340 are formed in semiconductor wafer 300. Contactpads 332 are formed in each die 330. An interconnect connects the contact pads 332 todie surface contact regions 210, 212. Scribe trenches 348 are formed in device wafer 300;corresponding trenches 358 are formed in cover wafer 360. The cover wafer 360 isthinned to open scribe trenches 348. Conductive vias 310-313 connect the contact pads210, 212 to external surface bump contacts 333.

申请人:HARRIS CORPORATION

地址:1025 West NASA Boulevard Melbourne Florida 32919 US

国籍:US

代理机构:Liesegang, Roland, Dr.-Ing.

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